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Product information

Rainer ARCA MRW Series

Featuring 2 nd Gen Intel Xeon Scalable Processors

Rainer MRW Series delivers power and performance at peak efficiency in a 1U and 2U rack mount server form factor that features the energy-efficient dual 2nd Generation Intel® Xeon® Scalable processor family. High memory capacity, networking, storage, and I/O flexibility combine with innovative design to provide an exceptional and reliable server for business IT, appliance, data center, cloud, and high performance computing applications.


Dual CPU sockets with support for the 2nd Generation Intel® Xeon Scalable processor family

Up to 24 DDR4 DIMMs.

Up to 12 Intel® Optane™ DC Persistent Memory modules (six per CPU).

Three riser card slots with support for up to eight PCIe* 3.0 add-in cards for high configuration flexibility.

Four onboard PCIe OCuLink connectors for direct attach NVMe* 2.5” SSD support.

Networking flexibility via 10G SFP+ and 10GBase-T OCP mezzanine modules.

Available in 1U and 2U systems with support for up to 24 NVMe* drives in a 2U chassis.

Support for the full line of Intel® RAID Modules.

Full-Featured and Versatile with Power and Performance at Peak Efficiency

• Intel® Server Board S2600WF is available in three feature-optimized family SKUs for maximum flexibility in configuration : Dual 10GbE integrated LAN ports, no integrated QAT support; Integrated Intel® QAT support, no integrated LAN Ports, reduced SATA/NVMe ports; No integrated LAN ports, no integrated Intel QAT support.

• Common use cases : HPC service node and burst buffer node; HCI for scale out using network for agility and flexibility; Databases requiring optimal compute to storage ratio; Storage for NVMe* hot and warm tier data, Cloud Infrastructure at scale.

• HPC Service Node Workloads : Genomic sequencing, Seismic modeling, Computational fluid dynamics, High frequency trading.

• Storage Workloads : Scale-up high performance storage, Scale-out storage for HCI.

• Cloud Workloads : Virtualization and multi-tenancy, Private and hybrid cloud.



• (2) Socket-P LGA3647.

• 2nd Generation Intel® Xeon® Scalable processor family (Platinum, Gold, Silver, and Bronze).


Intel C624 Chipset and Intel C628 Chipset (Depend-on SKU).


• (24) DIMMs, (6) channels per processor, (2) DIMMS per channel.

• DDR4 RDIMMs or LRDIMMs 2667/2933.

• Up to 4.5 TB for select Gold/Platinum CPUs,1 TB for Silver/Bronze CPUs.

PCIe Support

(3) riser card slots. supporting up to (8) PCIe 3.0 add-in cards.


• (2) single prot 7-pin SATA 6 Gbps Connectors

• (2) 4-port SATA mini-SAS HD connector (Depend on SKU)

• (2) 80-mm M.2 connectors

• (2) or (4) PCIe OCuLink Connector for direct attach NVMe 2.5" SSDs (Depend on SKU)


• Dual 10GbE Base-T ports (Depend on SKU)

• OCP Mezzanine Modules (10GBase-T options) - Depend on SKU

I/O Ports

• (3) external USB 3.0 Ports.

• (1) esternal RJ45 Serial Port A Connector.

• (1) internal DH-10 Serial-B port header for optional rear serial port support.

Advanced Technology

• OCP Module Support, support of several available PCIe x2 OCP KR-based mezzanine module options-!GbE Cu, 10GbE Cu/SFP+.

• SAS RAID Support, support for one of several available 12 GB/s Intel Integrated RAID Module Options.

Security & Reliability

One connector for optional TPM 2.0 module.

Form Factor

• Rackmount case 1U : AC 1100W Platinum, AC 1300W Titanium, DC 750W Gold redundant supported.

• Rackmount case 2U : AC 1100W Platinum, AC 1300W Titanium, DC 750W Gold redundant supported.

Drive Bay

• Rackmount Case 1U Option : (4) 3.5"" Hot Swap drive bays SAS/SATA Backplane, (8) 2.5"" Hot Swap drive bays SAS/SATA/NVMe combo backplane.

• Rackmount Case 2U Option : (8) 3.5” SAS/SATA hot swap drive bays F70, (12) 3.5” SA.

Front Panel

• Rackmount Case 1U : Power Button + LED, System ID Button+LED, System Status LED, Drive Activity LED, Reset Button, Nic Activity LED, (2) USB 2.0 Ports, (1) VGA Port.

• Rackmount Case 2U : Power Button + LED, System ID Button+LED, System Status LED, D