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Product information

  • Category: High-End Level
  • Product Series: Rainer HRK Series

Rainer HRK Series

Featuring 3rd Gen Intel® Xeon® Scalable Processors

Rainer HRK Series sets a new standard for 2U, upper-end mainstream servers by combining extraordinary density and versatility for both scale-up or scale-out workloads.

Rainer HRK Series is high compute and memory capacity make it ideal to maximize consolidation for Virtual Machines(VM) and container workloads to reduce sprawl and TCO (Total Cost of Ownership).

Rainer HRK Series is a great scale-up server choice for compute-intensive or memory-bound workloads, delivering outstanding performance, scalability and TCO for your more demanding needs.

3rd Gen Intel® Xeon® Scalable processors with 6 UPI and other Intel innovations integrated into the Rainer HRK Series deliver workload-optimized performance with built-in AI acceleration, and improved memory and I/O throughput versus prior generation processors.

Overview

(4)Socket, 2U Server with High Compute, Memory and Storage Capacity.

3rd Gen Intel® Xeon® Scalable processors.

Up to 28 cores per processor, 4 Sockets, for up to 112 cores per server.

Six Intel® UPI for increased CPU I/O throughput, 2x from previous generation

Intel® Optane™ persistent memory 200 series support.

Up to 15 TB system memory, 3 TB of DRAM, plus 12 TB of Intel® Optane™ persistent memory when using App Direct Mode.

(48) DIMMs total, (12) DDR4 DIMM per socket;

(1) 100GbE Intel® 800 Ethernet Series OCP3.0, 1x 1GB, RMM4 dedicated NIC.

(24) 2.5” SAS/SATA/SSD/NVMe hot-swappable drives (front access).

(2) M.2 SSDs (internal).

•  Cloud

Consolidate scale out workloads; Distributed web scale cache stores that provide in-memory caching of key-value type data (Memcached, Redis, KeyDB); Containerized deployments. (Kubernetes, Red Hat OpenShift, etc.).

•  Analytics

Big-data processing engines such as Apache Spark or Presto; Applications performing real-time processing of big unstructured data (financial services, Hadoop/Spark clusters); Ingest applications (typically government/ defense), where large data gets consumed, manipulated, then stored for later post-processing.

•  VM /Container Density

More VMs, fewer stranded resources; Large VM (VMware, oVirt, KVM, etc.).

•  In-Memory Database

In-memory databases using optimized data storage formats and analytics for business intelligence (eg: SAP HANA); Distributed web scale cache stores that provide in-memory caching of key-value type data (Memcached, Redis, KeyDB).

•  Scale-Up

High-performance, relational (MySQL, Postgres, Oracle, DB2) and NoSQL (MongoDB, Cassandra) databases; Big memory high-performance computing (HPC. i.e. reservoir simulation) and Electronic Design Automation (EDA) applications.

Specifications

Processor

• (4) socket P+ (4189 pin) processor sockets; Supported Processor 3rd Gen Intel® Xeon® Scalable processor family.

• Gold 63xx (H) (HL) and Platinum 83xx (H) (HL); Up to 28 Cores per processor / Up to 112 Cores per system, Six (6) UPI links per processor, UPI Speeds up to 10.4GT/s, Maximum supported processor TDP: ≤ 250W.

** Supported 3rd Gen Intel® Xeon® Scalable processor SKUs must end in (H) or (HL). All other processor SKUs are not supported.

** Previous generation Intel® Xeon® processor and Intel® Xeon® Scalable processor families are not supported.

Chipset

Intel® C621 Chipset

Memory

(48) DIMMs, (12) DIMMs per processor socket

• (6) memory channels per processor

• (2) DIMM slots per memory channel

DDR4 – RDIMM, RDIMM-3DS, LRDIMM, LRDIMM-3DS

Supported Memory Speeds in MT/s: DDR4 SDRAM DIMM Only Configurations

• Platinum 83xx: 3200 (1 or 2 DPC); 2933 (1 or 2 DPC) (DPC – DIMMs per Channel)

• Gold 63xx: 2933 (1 or 2 DPC)

Intel® Optane™ persistent memory 200 Series (App Direct Mode Only)

Memory Speeds in MT/s: 2666 (Intel® Optane™ PMem + DDR4 SDRAM configurations)

PCIe Support

Standar System ( No GPU Support) :

Up to six (6) onboard (default)

• Up to 10 with riser card options

• Up to 12 with riser card options + Aux PCIe cabling option

System with GPU Support

• Up to four (4) onboard

• Up to four (4) with riser cards

- 2 x GPU – (FH, FL, DW)

- 2 x PCIe X8 – (FH, HL) with Aux PCIe cabling optio

Storage

Internal M.2 SSD support :

Standar System ( No GPU Support); Up to two (2) internal mount M.2 SATA SSDs, 2280 and 22110 form factors supported

System with GPU Support :

Up to two (2) internal mount M.2 SATA SSDs; 2280 and 22110 form factors supported

Networking

Up to 100 Gb Ethernet support with Open Compute Project (OCP) 3.0 Module :

• Dual Port RJ45, 10/1 GbE

• Quad port SFP+ DA, 4x 10 GbE

• Dual port QSFP28, 100/50/25/10 GbE

• Dual port SFP2815 15/10 GbE

I/O Ports

(1) VGA Port

(2) USB 3.0 Ports

(1) Dedicated Management Port RJ45

(1) Serial Port interface connector

(1) BMC Serial Port interface connector

(1) UID Button/LED

Advanced Technology

Tool-less (Removal / Installation)

• Top cover

• PCIe add-in cards and OCP 3.0 Add-in card

• System fans – hot swappable

• System fan housing

• Power Distribution Board

• Power Supply Module(s) – hot swappable in 1+1 redundant configuration

• Front Drive Bay Backplane(s)

• Front Mount Drives – Hot Swappable in fault tolerant RAID configurations.

• Screws required to mount drive to drive carrier

Security & Reliability

TPM 2.0 Option (Rest of the world) - iPC KLPTPM (Note: China only TPM not available).

Intel® PFR – Intel® Platform Firmware Resilience.

Intel® CBnT – Converged Boot Guard and Intel® Trusted Execution (Intel® TXT).

Form Factor

2U Rackmount

Standar System ( No GPU Support) :

Two (2) CRPS AC 2000W (80-Plus Platinum) power supply modules

Supported operating modes:

• 1+1 Redundant power (hot swappable)

• 2+0 Combined Power (No power redundancy)

System with GPU Support :

Two (2) CRPS AC 2000W (80-Plus Platinum) power supply modules

Supported operating modes:

• 1+1 Redundant Power (hot swappable)

• 2+0 Combined Power (No power redundancy)

Drive Bay

Standart System (No GPU Support) :

(8), (16), or (24) Hot Swap Drive Bays; 2.5" SSDs; SAS, SATA, NVME

System with GPU Support :

(8) Hot Swap Drive Bays; 2.5" SSDs; SAS, SATA, NVME

Front Panel

Left Front Control Panel Features

• System Power Button / LED

• UID Button / LED

• Various system feature/status LEDs

Right Front I/O Panel Features

• VGA connector

• One (1) USB 3.0 connector

• One (1) USB 2.0 connector