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Rainer CANDI HD3 Series

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Product information

Rainer CANDI HD3 Series

Featuring 3rd Generation Intel® Xeon® Scalable Processor

Rainer’s Hd3 series offers density optimized performance for HPC and AI applications while expanding the breadth of solutions possible. Four distinct module types are available, each providing unique features for compute, management, storage, and accelerator functionality.

Compute Module : Compute modules are available as air-cooled or liquid-cooled, with two high-speed 3rd Generation Intel Xeon Scalable processors, two low- profile PCIe card slots, and two M.2 storage slots. The liquid-cooled option enables enhanced cooling efficiency versus previous liquid-cooled designs and can improve your data center’s overall engery efficiency.

Key Features

  • High-performance compute: 3rd Generation Intel Xeon Scalable processors deliver outstanding per-core
  • performance, with up to 40 cores per processor and 1.46x average performance improvement versus the previous generation.1
  • Accelerate AI workloads: Intel® Deep Learning Boost greatly accelerates AI inferencing, enabling you to run workloads on versatile, general-purpose processors without compromise.
  • Speed I/O between processors: Three Intel® Ultra Path Interconnects (Intel® UPI) accelerate I/O between processors versus the previous generation.
  • High memory bandwidth: Up to 3200 MT/s throughput, with up to 1 TB of DRAM capacity per processor.
  • Expand memory capacity: Intel® Optane™ persistent memory 200 series support enables up to 3 TB of memory capacity per processor and provides an average of 32% higher memory bandwidth versus the previous generation.2
  • Breakthrough storage capacity and performance with affordable capacity: Up to 1 PB of high-performance NVMe storage per 2U chassis with dual storage modules.
  • High-speed networking and I/O: Accelerate network throughput between cluster nodes with high-throughput Intel® Omni-Path and InfiniBand support. PCIe 4.0 support delivers extraordinary data throughput for storage and networking.
  • Hardware-enhanced security: Help protect against malicious exploits and accelerate data encryption with built-in security features, while maintaining workload integrity and reduced performance overhead.

Key Applications

  • High Performance Computing (HPC) and Advanced AI analitycs application

Specifications

Processor

For Compute Module, Accelerator Module, Storage Module, Management Module :

• Dual Socket-P4 LGA4189.

• Supported 3rd Gen Intel® Xeon® Scalable processor family SKUs: Intel® Xeon® Platinum 8300 processor; Intel® Xeon® Gold 6300 processor; Intel® Xeon® Gold 5300 processor; Intel® Xeon® Silver 4300 processor.

• UPI links: three at 11.2 GT/s (Platinum and Gold SKUs) or two at 10.4 GT/s (Silver SKU).

Note: Supported 3rd Gen Intel® Xeon® Scalable processor SKUs must Not end in (H), (L), or (U). All other processor SKUs are supported; Previous generation Intel® Xeon® processor and Intel® Xeon® Scalable processor families are not supported.
Chipset

Intel® C621A Chipset
Memory

• Memory support : (Compute Module, Accelerator Module, Storage Module)

Up to 16 DDR4 DIMMs + up to 8 Intel® Optane™ persistent memory 200 series modules; All DDR4 DIMMs must support ECC, Registered DDR4 (RDIMM), 3DS-RDIMM, Load Reduced DDR4 (LRDIMM), 3DS-LRDIMM; Intel® Optane™ persistent memory 200 series module (air-cooled systems only); Up to 3200 MT/s memory data transfer rates; Up to 2 TB DDR4 memory capacity for both processors (1 TB per processor), for all processor SKUs; Up to 6 TB DDR4 and Intel® Optane™ PMem combined memory capacity for both processors (3 TB per processor), for all processor SKUs; DDR4 standard voltage of 1.2 V.

Note: The speed supported depends on the installed processor.

• Memory support : (Management Module)

Up to 16 DDR4 DIMMs; All DDR4 DIMMs must support ECC; Registered DDR4 (RDIMM), 3DS-RDIMM, Load Reduced DDR4 (LRDIMM), 3DS-LRDIMM Note: 3DS = 3-dimensional Stacking; Up to 3200 MT/s memory data transfer rates; Up to 2 TB DDR4 memory capacity for both processors (1 TB per processor), for all processor SKUs; DDR4 standard voltage of 1.2 V.

Note: The speed supported depends on the installed processor. See Chapter 6 for details.
PCIe Support

• OCuLink 2 x8 (via OCuLink connectors ) : Storage & Acclelerator Modules.

• 1U PCIe SLOT/2U Bottom PCIe Slot (via Riser slot) : Compute, Management, Storage & Accelerator Modules.

• U.2 SSD ( Via Riser Slot) : Management & Accelerator Modules.

• M.2 SSD (Via Riser Slot) : Compute, Management, Storage & Accelerator Modules.
Storage

• Compute Module : 2x M.2 SATA/NVMe SSDs80 or 110 mm.

• Accelerator Module : 2x M.2 SATA/NVMe SSDs 80 or 110 mm and 2x U.2 NVMe hot-swap SSDs.

• Storage Module : 2x M.2 SATA/NVMe SSDs 80 or 110 mm and 16x E1.L NVMe hot-swap SSDs.

• Management Module : 2x M.2 SATA/NVMe SSDs 80 or 110 mm and 2x U.2 NVMe hot-swap SSDs.
Networking

Networking support : (All Module)

• One external 10GBASE-T Ethernet port (RJ45).

• One external dedicated 1000BASE-T Ethernet management port (RJ45).
I/O Ports

• I/O Ports support : (All Module)

One USB 3.0 port; One I/O breakout cable connector supporting the following:

• Two USB 3.0 ports (dual-stack)

One VGA connector (16 MB of DDR4 video memory); One serial port connector. The port follows AT pinout specifications.

Note: The I/O breakout cable is available as an accessory option (iPC: AXXCONNTDBG).
Advanced Technology

Four Distinct Modules to Address Specific HPC and AI Needs

Compute module: Compute modules are available as air-cooled or liquid-cooled, with two high-speed 3rd Generation Intel Xeon Scalable processors, two low-profile PCIe card slots, and two M.2 storage slots. The liquid-cooled option enables enhanced cooling efficiency versus previous liquid-cooled designs and can improve your data center’s overall energy efficiency.

Accelerator module: Accelerate HPC and AI workloads with two 3rd Generation Intel Xeon Scalable processors and support for four full-height, full-length, double-wide PCIe accelerator cards, in addition to four low-profile PCIe cards with M.2 and U.2 storage options.

Management module: Manage your HPC rack with two powerful 3rd Generation Intel Xeon Scalable processors. Each module provides four low-profile PCIe cards with M.2 and U.2 storage options.

Storage module: Enables high density storage scalability for data-centric workloads, with up to 16 NVMe E1.L SSDs for up to 500 terabytes of storage capacity per module, along with two 3rd Generation Intel Xeon Scalable processors and two low-profile PCIe cards.

Option Cooling : Air-Cooled (Standard Heat Sinks Shown) and Liquid-Cooled Compute Modules.
Security & Reliability

• Intel® Platform Firmware Resilience (Intel® PFR) technology.

• Intel® Total Memory Encryption (Intel® TME).

• Intel® Software Guard Extensions (Intel® SGX).

• Intel® CBnT – Converged Intel® Boot Guard and Trusted Execution Technology (Intel® TXT).

• Trusted platform module 2.0 (Rest of World) – iPC AXXTPMENC8 (accessory option).

• Trusted platform module 2.0 (China Version) – iPC AXXTPMCHNE8 (accessory option.
Form Factor

• Compute Module :

1U, half-width modules, Air/Liquid Cooled, upto four modules per chassis.

• Accelerator Module :

2U, full-width modules, Air Cooled, one module per chassis.

• Storage Module :

2U, half-width modules, Air Cooled, Air Cooled, upto two modules per chassis.

• Management Module :

2U, half-width modules, Air Cooled, upto two modules per chassis.
Drive Bay

Drive bay support :

• Compute Module : no drive Bays.

• Accelerator Module : Two hot-swap 2.5” U.2 PCIe* NVMe* SSDs with PCIe* 4.0 .

• Storage Module :Up to 16 EDSFF NVMe* SSDs through the docking board and OCuLink connectors.

• Management Module : (2) NVMe U.2 SSD slot (CPU 0): x4 PCIe 4.0.
Front Panel

• Module status

• Module ID

• Power

• Module ID

• Module cold reset

• Non-maskable interrupt (NMI)