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Rainer’s Hd3 series oﬀers density optimized performance for HPC and AI applications while expanding the breadth of solutions possible. Four distinct module types are available, each providing unique features for compute, management, storage, and accelerator functionality.
Compute Module : Compute modules are available as air-cooled or liquid-cooled, with two high-speed 3rd Generation Intel Xeon Scalable processors, two low- proﬁle PCIe card slots, and two M.2 storage slots. The liquid-cooled option enables enhanced cooling eﬃciency versus previous liquid-cooled designs and can improve your data center’s overall engery eﬃciency.
High-performance compute: 3rd Generation Intel Xeon Scalable processors deliver outstanding per-core
performance, with up to 40 cores per processor and 1.46x average performance improvement versus the previous generation.1
Accelerate AI workloads: Intel® Deep Learning Boost greatly accelerates AI inferencing, enabling you to run workloads on versatile, general-purpose processors without compromise.
Speed I/O between processors: Three Intel® Ultra Path Interconnects (Intel® UPI) accelerate I/O between processors versus the previous generation.
High memory bandwidth: Up to 3200 MT/s throughput, with up to 1 TB of DRAM capacity per processor.
Expand memory capacity: Intel® Optane™ persistent memory 200 series support enables up to 3 TB of memory capacity per processor and provides an average of 32% higher memory bandwidth versus the previous generation.2
Breakthrough storage capacity and performance with affordable capacity: Up to 1 PB of high-performance NVMe storage per 2U chassis with dual storage modules.
High-speed networking and I/O: Accelerate network throughput between cluster nodes with high-throughput Intel® Omni-Path and InfiniBand support. PCIe 4.0 support delivers extraordinary data throughput for storage and networking.
Hardware-enhanced security: Help protect against malicious exploits and accelerate data encryption with built-in security features, while maintaining workload integrity and reduced performance overhead.
High Performance Computing (HPC) and Advanced AI analitycs application